EP3SE260H780I4 vs EP3SE260H780I4N 对比

详细并排对比 EP3SE260H780I4 出自 Intel 和 EP3SE260H780I4N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE260H780I4N EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel

EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel

EP3SE260H780I4N ⚠ 最后一次采购

规格对比

参数 EP3SE260H780I4 EP3SE260H780I4N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 最后采购期
库存状态 有库存 有库存
单价(USD) $1,390.00 $2,150.00
Family Stratix III Enhanced (Stratix III E) Stratix III Enhanced (Stratix III E)
Logic Elements 255,000 255,000
Logic Cells 255,000 —
Logic Array Blocks (LABs) 10,200 10,200
Adaptive Logic Modules (ALMs) approximately 203,200 —
Maximum User I/Os 488 —
Process Technology 65 nm CMOS 65 nm
Core Voltage 1.1 V 1.1 V
Embedded RAM (total) approximately 14.4 Mbit (M9K/M144K blocks) —
DSP Blocks approximately 768 (18x18 multipliers) —
Maximum Operating Frequency up to 450 MHz core / 717 MHz per Partstack record 450 MHz
封装 780-ball FC-HFBGA (HBGA) 780-pin FC-HFBGA (FCBGA)
工作温度 -40C to +100C (industrial, 'I' grade) -40C to +100C (Industrial)
Speed Grade 4 —
安装类型 Surface Mount (BGA) —
Configuration Schemes JTAG, Passive Serial, Fast Passive Parallel, Active Serial —
RoHS 状态 [DATA_NEEDED: RoHS compliance status] Compliant
Embedded Memory Bits — 16,672,768 bits
User I/Os — 488
Package Dimensions — 33 mm x 33 mm
Ball Pitch — [DATA_NEEDED: BGA ball pitch in mm]
Configuration Modes — AS, PS, JTAG, FPP
Boundary Scan — IEEE Std. 1149.1 (JTAG)
Lead-Free — Yes
Moisture Sensitivity Level — [DATA_NEEDED: MSL rating]

数据手册与资源

浏览全部产品 创建 BOM 获取报价