EP3SE260H780I4 vs EP3SL200H780I4 Vergleich
Detaillierter Direktvergleich von EP3SE260H780I4 von Intel und EP3SL200H780I4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260H780I4 | EP3SL200H780I4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.390,00 | $6.255,75 |
| Family | Stratix III Enhanced (Stratix III E) | Stratix III |
| Logic Elements | 255,000 | — |
| Logic Cells | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | 8000 |
| Adaptive Logic Modules (ALMs) | approximately 203,200 | — |
| Maximum User I/Os | 488 | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 1.1 V | — |
| Embedded RAM (total) | approximately 14.4 Mbit (M9K/M144K blocks) | — |
| DSP Blocks | approximately 768 (18x18 multipliers) | — |
| Maximum Operating Frequency | up to 450 MHz core / 717 MHz per Partstack record | — |
| Gehäuse | 780-ball FC-HFBGA (HBGA) | — |
| Betriebstemperatur | -40C to +100C (industrial, 'I' grade) | — |
| Speed Grade | 4 | I4 (industrial) |
| Montageart | Surface Mount (BGA) | — |
| Configuration Schemes | JTAG, Passive Serial, Fast Passive Parallel, Active Serial | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Series | — | Stratix III L |
| Logic Elements (LE) | — | 200,000 |
| Embedded Memory Bits | — | 10,901,504 |
| User I/O Count | — | 488 |
| DSP Multipliers (18x18) | — | 384 |
| Voltage - Core Supply | — | 1.1 V |
| Package Type | — | 780-BBGA / FCBGA (FC-HFBGA) |
| Package Dimensions | — | 33 mm x 33 mm |
| Betriebs-Sperrschichttemperatur | — | -40C to +100C (industrial) |
| Configuration Memory | — | SRAM-based, volatile |
| Design Tool | — | Quartus II (legacy) / Quartus Prime |