EP3SE50F484C3G vs EP3SE50F484C4LG Vergleich
Detaillierter Direktvergleich von EP3SE50F484C3G von Intel und EP3SE50F484C4LG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE50F484C3G | EP3SE50F484C4LG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $205,00 | $370,60 |
| Family | Stratix III E | Stratix® III E |
| Logic Elements | 47,500 | 47,500 LE |
| Adaptive Logic Modules (ALMs) | 19,000 | 19,000 ALM |
| Total Embedded Memory | 5,760,000 bits (5.76 Mbit) | — |
| M9K Memory Blocks | 320 (2,304 Kbits) | — |
| M144K Memory Blocks | 12 (1,728 Kbits) | — |
| User I/O Pins | 296 | — |
| 18x18 Multipliers | 384 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 16 | — |
| Gehäuse | 484-ball FCBGA (F484), 1.0 mm pitch | 484-Ball FCBGA, 23 x 23 mm |
| Speed Grade | C3 | -4 |
| Betriebstemperatur | 0C to +85C (commercial, "C") | — |
| Process Node | 65 nm TSMC low-power | 40 nm TSMC |
| Core Voltage | 1.1 V | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant (lead-free) | — |
| Embedded Memory | — | 5.49 Mbit (2,886 Kbit M9K + M144K blocks) |
| Maximum User I/O | — | 296 |
| Hardware Multipliers (18x18) | — | 384 |
| Operating Supply Voltage (Core) | — | 1.1 V |
| Betriebstemperaturbereich | — | 0°C to +85°C (Commercial) |
| Lead-Free / RoHS | — | Yes (lead-free finish, RoHS compliant) |
| MSL-Level | — | 3 (per JEDEC J-STD-020) |
| Design Software | — | Quartus II 11.0 or later |