EP3SE50F484C3G vs EP3SE50F484C4LG Comparación
Comparación detallada lado a lado de EP3SE50F484C3G por Intel y EP3SE50F484C4LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE50F484C3G | EP3SE50F484C4LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $205,00 | $370,60 |
| Family | Stratix III E | Stratix® III E |
| Logic Elements | 47,500 | 47,500 LE |
| Adaptive Logic Modules (ALMs) | 19,000 | 19,000 ALM |
| Total Embedded Memory | 5,760,000 bits (5.76 Mbit) | — |
| M9K Memory Blocks | 320 (2,304 Kbits) | — |
| M144K Memory Blocks | 12 (1,728 Kbits) | — |
| User I/O Pins | 296 | — |
| 18x18 Multipliers | 384 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 16 | — |
| Encapsulado | 484-ball FCBGA (F484), 1.0 mm pitch | 484-Ball FCBGA, 23 x 23 mm |
| Speed Grade | C3 | -4 |
| Temperatura de funcionamiento | 0C to +85C (commercial, "C") | — |
| Process Node | 65 nm TSMC low-power | 40 nm TSMC |
| Core Voltage | 1.1 V | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant (lead-free) | — |
| Embedded Memory | — | 5.49 Mbit (2,886 Kbit M9K + M144K blocks) |
| Maximum User I/O | — | 296 |
| Hardware Multipliers (18x18) | — | 384 |
| Operating Supply Voltage (Core) | — | 1.1 V |
| Rango de temperatura de funcionamiento | — | 0°C to +85°C (Commercial) |
| Lead-Free / RoHS | — | Yes (lead-free finish, RoHS compliant) |
| Nivel MSL | — | 3 (per JEDEC J-STD-020) |
| Design Software | — | Quartus II 11.0 or later |