EP3SE50F484C3N vs EP3SE50F484C2N Vergleich
Detaillierter Direktvergleich von EP3SE50F484C3N von Intel und EP3SE50F484C2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE50F484C3N | EP3SE50F484C2N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $832,10 | $5.934,83 |
| Family | Stratix III E | Stratix III E FPGA |
| Device Logic Elements | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | — |
| Adaptive Logic Modules (ALMs) | 18,750 | — |
| Embedded Memory (Bits) | 5,760,000 | — |
| User I/Os | 296 | 296 |
| Maximum Internal Frequency | 717 MHz (typical); 800 MHz per DigChip | — |
| Process Technology | TSMC 40 nm low-power CMOS | 65 nm |
| Gehäuse | 484-ball FBGA (FCBGA), 1.0 mm pitch | 484-ball FCBGA (F484, 23x23 mm, 1.0 mm pitch) |
| Versorgungsspannung | Core and I/O voltages per Stratix III E datasheet | — |
| Betriebstemperatur | 0C to +85 C (commercial, C suffix) | 0C to +85C (Commercial) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL-Level | 3 (per JEDEC J-STD-020 for FCBGA packages) | — |
| RoHS-Status | Lead-free (per DigiKey listing) | Compliant |
| Configuration Mode | Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG | — |
| Design Software | Intel Quartus II (Stratix III support) | — |
| Lebenszyklusstatus | Obsolete (per Worldway listing 2026-04-05) | — |
| Series | — | Stratix III E |
| Logic Elements | — | 47,500 |
| Embedded Memory | — | 2,304 Kbits |
| DSP Blocks (18x18) | — | 264 |
| LABs/CLBs | — | 1,900 |
| Core Voltage | — | 0.9 V / 1.1 V |
| Internal Frequency | — | 600 MHz |
| Lead-Free | — | Yes |