EP3SE50F484C3N vs EP3SE50F484C2N 对比
详细并排对比 EP3SE50F484C3N 出自 Intel 和 EP3SE50F484C2N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE50F484C3N | EP3SE50F484C2N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $832.10 | $5,934.83 |
| Family | Stratix III E | Stratix III E FPGA |
| Device Logic Elements | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | — |
| Adaptive Logic Modules (ALMs) | 18,750 | — |
| Embedded Memory (Bits) | 5,760,000 | — |
| User I/Os | 296 | 296 |
| Maximum Internal Frequency | 717 MHz (typical); 800 MHz per DigChip | — |
| Process Technology | TSMC 40 nm low-power CMOS | 65 nm |
| 封装 | 484-ball FBGA (FCBGA), 1.0 mm pitch | 484-ball FCBGA (F484, 23x23 mm, 1.0 mm pitch) |
| 电源电压 | Core and I/O voltages per Stratix III E datasheet | — |
| 工作温度 | 0C to +85 C (commercial, C suffix) | 0C to +85C (Commercial) |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL 等级 | 3 (per JEDEC J-STD-020 for FCBGA packages) | — |
| RoHS 状态 | Lead-free (per DigiKey listing) | Compliant |
| Configuration Mode | Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG | — |
| Design Software | Intel Quartus II (Stratix III support) | — |
| 生命周期状态 | Obsolete (per Worldway listing 2026-04-05) | — |
| Series | — | Stratix III E |
| Logic Elements | — | 47,500 |
| Embedded Memory | — | 2,304 Kbits |
| DSP Blocks (18x18) | — | 264 |
| LABs/CLBs | — | 1,900 |
| Core Voltage | — | 0.9 V / 1.1 V |
| Internal Frequency | — | 600 MHz |
| Lead-Free | — | Yes |