EP3SE50F484C4L vs EP3SE50F484C3N Vergleich
Detaillierter Direktvergleich von EP3SE50F484C4L von Intel und EP3SE50F484C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE50F484C4L | EP3SE50F484C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.020,00 | $832,10 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | 1,900 |
| Embedded Memory | 5,760 Kbits (M9K + M144K + MLAB) | — |
| Embedded Multipliers (18x18) | 384 | — |
| Maximum User I/Os | 296 | — |
| Process Technology | 65 nm CMOS | TSMC 40 nm low-power CMOS |
| Speed Grade | -4 (performance-oriented) | — |
| Temperature Grade | Commercial (0 C to +85 C) | — |
| Gehäuse | 484-ball FC-FBGA | 484-ball FBGA (FCBGA), 1.0 mm pitch |
| Core Voltage (typical) | 0.9 V | — |
| PLLs | 12 | — |
| Lead-Free Finish | Yes (L suffix) | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL-Level | 3 (168 hours) | 3 (per JEDEC J-STD-020 for FCBGA packages) |
| Device Logic Elements | — | 47,500 |
| Adaptive Logic Modules (ALMs) | — | 18,750 |
| Embedded Memory (Bits) | — | 5,760,000 |
| User I/Os | — | 296 |
| Maximum Internal Frequency | — | 717 MHz (typical); 800 MHz per DigChip |
| Versorgungsspannung | — | Core and I/O voltages per Stratix III E datasheet |
| Betriebstemperatur | — | 0C to +85 C (commercial, C suffix) |
| RoHS-Status | — | Lead-free (per DigiKey listing) |
| Configuration Mode | — | Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG |
| Design Software | — | Intel Quartus II (Stratix III support) |
| Lebenszyklusstatus | — | Obsolete (per Worldway listing 2026-04-05) |