EP3SE50F484I4LN vs EP3SE50F484I4LG Vergleich
Detaillierter Direktvergleich von EP3SE50F484I4LN von Intel und EP3SE50F484I4LG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE50F484I4LG - 47.5K LE Stratix III E FPGA, 484-FCBGA | Intel
EP3SE50F484I4LG ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE50F484I4LN | EP3SE50F484I4LG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $895,00 | $1.340,00 |
| Family | Stratix III E | Stratix III (Enhanced) |
| Logic Elements (LE) | 47,500 | 47,500 |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory | 5.76 Mbit (estimated from 47.5K LE family) | — |
| User I/O Count | 296 | 296 |
| Process Node | 65 nm | — |
| Core Voltage (VCCINT) | 0.9 V | — |
| Auxiliary Voltage (VCCAUX) | 1.1 V | — |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V (bank-dependent) | — |
| Gehäuse | 484-ball FBGA (FineLine BGA) | 484-ball FBGA / FCBGA |
| Pin/Pitch | 484 balls, 1.0 mm pitch | — |
| Betriebstemperatur | -40C to +100C (industrial I4 grade) | — |
| Configuration | SRAM-based (external flash/EPCS required) | — |
| RoHS-Status | Compliant (LN suffix indicates lead-free) | Compliant |
| Lead-Free | Yes (LF / N suffix indicates lead-free) | — |
| Transceivers | 0 (F484 package does not include transceiver banks) | — |
| PLL Count | Up to 12 (estimated for Stratix III E family) | — |
| DSP Blocks (18x18 Multipliers) | [DATA_NEEDED: DSP block count] | — |
| Design Tool | Quartus II (legacy, support via Altera/Intel subscription) | — |
| Series | — | Stratix III E |
| Adaptive Logic Modules (ALMs) | — | 19,000 |
| LABs/CLBs | — | 1,900 |
| Total Embedded Memory | — | 5,760,000 bits (5.49 Mbit / 5.76 Mbit per source) |
| Number of DSP Blocks | — | 104 (18x18 multipliers) |
| Number of PLLs | — | 8 |
| Core Supply Voltage (Vccint) | — | 0.86 V to 1.15 V (1.1 V nominal) |
| Betriebstemperaturbereich | — | -40C to +100C (Industrial, TJ) |
| Montageart | — | Surface Mount (SMD/SMT) |
| Packaging | — | Tray |
| Process Technology | — | 40 nm CMOS |
| Configuration Interface | — | Passive Serial / Fast Passive Parallel / JTAG |
| Bitstream Encryption | — | 256-bit AES |