EP3SE50F484I4LN vs EP3SE50F484I4LG Comparaison
Comparaison détaillée côte à côte de EP3SE50F484I4LN par Intel et EP3SE50F484I4LG par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP3SE50F484I4LG - 47.5K LE Stratix III E FPGA, 484-FCBGA | Intel
EP3SE50F484I4LG ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP3SE50F484I4LN | EP3SE50F484I4LG |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $895,00 | $1 340,00 |
| Family | Stratix III E | Stratix III (Enhanced) |
| Logic Elements (LE) | 47,500 | 47,500 |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory | 5.76 Mbit (estimated from 47.5K LE family) | — |
| User I/O Count | 296 | 296 |
| Process Node | 65 nm | — |
| Core Voltage (VCCINT) | 0.9 V | — |
| Auxiliary Voltage (VCCAUX) | 1.1 V | — |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V (bank-dependent) | — |
| Boîtier | 484-ball FBGA (FineLine BGA) | 484-ball FBGA / FCBGA |
| Pin/Pitch | 484 balls, 1.0 mm pitch | — |
| Température de fonctionnement | -40C to +100C (industrial I4 grade) | — |
| Configuration | SRAM-based (external flash/EPCS required) | — |
| Statut RoHS | Compliant (LN suffix indicates lead-free) | Compliant |
| Lead-Free | Yes (LF / N suffix indicates lead-free) | — |
| Transceivers | 0 (F484 package does not include transceiver banks) | — |
| PLL Count | Up to 12 (estimated for Stratix III E family) | — |
| DSP Blocks (18x18 Multipliers) | [DATA_NEEDED: DSP block count] | — |
| Design Tool | Quartus II (legacy, support via Altera/Intel subscription) | — |
| Series | — | Stratix III E |
| Adaptive Logic Modules (ALMs) | — | 19,000 |
| LABs/CLBs | — | 1,900 |
| Total Embedded Memory | — | 5,760,000 bits (5.49 Mbit / 5.76 Mbit per source) |
| Number of DSP Blocks | — | 104 (18x18 multipliers) |
| Number of PLLs | — | 8 |
| Core Supply Voltage (Vccint) | — | 0.86 V to 1.15 V (1.1 V nominal) |
| Plage de température de fonctionnement | — | -40C to +100C (Industrial, TJ) |
| Type de montage | — | Surface Mount (SMD/SMT) |
| Packaging | — | Tray |
| Process Technology | — | 40 nm CMOS |
| Configuration Interface | — | Passive Serial / Fast Passive Parallel / JTAG |
| Bitstream Encryption | — | 256-bit AES |