EP3SE50F484I4LN vs EP3SE50F484I4N Vergleich

Detaillierter Direktvergleich von EP3SE50F484I4LN von Intel und EP3SE50F484I4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE50F484I4LN EP3SE50F484I4N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $895,00 $998,00
Family Stratix III E —
Logic Elements (LE) 47,500 47,500
Logic Array Blocks (LABs) 1,900 1,900
Embedded Memory 5.76 Mbit (estimated from 47.5K LE family) —
User I/O Count 296 —
Process Node 65 nm —
Core Voltage (VCCINT) 0.9 V —
Auxiliary Voltage (VCCAUX) 1.1 V —
I/O Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V (bank-dependent) —
Gehäuse 484-ball FBGA (FineLine BGA) 484-ball FC-FBGA (F484)
Pin/Pitch 484 balls, 1.0 mm pitch —
Betriebstemperatur -40C to +100C (industrial I4 grade) 0 C to +85 C (Industrial)
Configuration SRAM-based (external flash/EPCS required) —
RoHS-Status Compliant (LN suffix indicates lead-free) —
Lead-Free Yes (LF / N suffix indicates lead-free) —
Transceivers 0 (F484 package does not include transceiver banks) —
PLL Count Up to 12 (estimated for Stratix III E family) —
DSP Blocks (18x18 Multipliers) [DATA_NEEDED: DSP block count] —
Design Tool Quartus II (legacy, support via Altera/Intel subscription) —
Device Family — Stratix III E
Adaptive Logic Modules (ALMs) — 19,000
Embedded Memory (TriMatrix) — 2,136 Kbits
Embedded Multipliers (18x18) — 384
User I/Os — 296
I/O Banks — 12
PLLs — 8
Global Clock Networks — 16
Maximum User I/O Frequency — 800 MHz (per DigChip datasheet summary)
Process Technology — 65 nm CMOS
Core Voltage — 1.1 V
Speed Grade — I4
Lead-Free / RoHS — Lead-free (per ampheo listing)

Datenblätter & Ressourcen

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