EP3SE50F484I4LN vs EP3SE50F484I4N Comparação

Comparação detalhada lado a lado de EP3SE50F484I4LN por Intel e EP3SE50F484I4N por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Comparação de especificações

Parâmetro EP3SE50F484I4LN EP3SE50F484I4N
Marca Intel Intel
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Obsolete NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $895,00 $998,00
Family Stratix III E —
Logic Elements (LE) 47,500 47,500
Logic Array Blocks (LABs) 1,900 1,900
Embedded Memory 5.76 Mbit (estimated from 47.5K LE family) —
User I/O Count 296 —
Process Node 65 nm —
Core Voltage (VCCINT) 0.9 V —
Auxiliary Voltage (VCCAUX) 1.1 V —
I/O Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V (bank-dependent) —
Encapsulamento 484-ball FBGA (FineLine BGA) 484-ball FC-FBGA (F484)
Pin/Pitch 484 balls, 1.0 mm pitch —
Temperatura de operação -40C to +100C (industrial I4 grade) 0 C to +85 C (Industrial)
Configuration SRAM-based (external flash/EPCS required) —
Status RoHS Compliant (LN suffix indicates lead-free) —
Lead-Free Yes (LF / N suffix indicates lead-free) —
Transceivers 0 (F484 package does not include transceiver banks) —
PLL Count Up to 12 (estimated for Stratix III E family) —
DSP Blocks (18x18 Multipliers) [DATA_NEEDED: DSP block count] —
Design Tool Quartus II (legacy, support via Altera/Intel subscription) —
Device Family — Stratix III E
Adaptive Logic Modules (ALMs) — 19,000
Embedded Memory (TriMatrix) — 2,136 Kbits
Embedded Multipliers (18x18) — 384
User I/Os — 296
I/O Banks — 12
PLLs — 8
Global Clock Networks — 16
Maximum User I/O Frequency — 800 MHz (per DigChip datasheet summary)
Process Technology — 65 nm CMOS
Core Voltage — 1.1 V
Speed Grade — I4
Lead-Free / RoHS — Lead-free (per ampheo listing)

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