EP3SL200H780I3 vs EP3SL200H780C2N Vergleich
Detaillierter Direktvergleich von EP3SL200H780I3 von Intel und EP3SL200H780C2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL200H780I3 | EP3SL200H780C2N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7.980,00 | $6.050,00 |
| Series | Stratix III L | — |
| Family | Stratix III | Stratix III L |
| Logic Elements | 200,000 | 200,000 |
| LABs (Logic Array Blocks) | 8000 | — |
| Total RAM Bits | 10,901,504 (10,900 Kb) | — |
| User I/O Count | 488 | 488 |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | — |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | — |
| PLLs | 12 | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Operating Frequency | 717 MHz | — |
| Betriebstemperatur | -40C to +100C (Industrial) | Commercial (0C to +85C) |
| Gehäuse | 780-BBGA, FCBGA (HBGA-780) | 780-ball HBGA / FCBGA |
| Montageart | Surface Mount | Surface Mount |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Lead-Free / RoHS | Compliant (lead-free) | — |
| Adaptive Logic Modules (ALMs) | — | 80,000 |
| Embedded Memory Bits | — | 10,901,504 |
| Maximum Internal Frequency | — | 800 MHz |
| Speed Grade | — | C2 |
| Transceivers | — | Per family capability - not specified for this OPN |
| Package Code | — | PBGA780 / HBGA-780 |
| Lead Free | — | Yes |
| RoHS-Status | — | Compliant |