EP3SL200H780I3 vs EP3SL200H780C2N 对比
详细并排对比 EP3SL200H780I3 出自 Intel 和 EP3SL200H780C2N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SL200H780I3 | EP3SL200H780C2N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $7,980.00 | $6,050.00 |
| Series | Stratix III L | — |
| Family | Stratix III | Stratix III L |
| Logic Elements | 200,000 | 200,000 |
| LABs (Logic Array Blocks) | 8000 | — |
| Total RAM Bits | 10,901,504 (10,900 Kb) | — |
| User I/O Count | 488 | 488 |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | — |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | — |
| PLLs | 12 | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Operating Frequency | 717 MHz | — |
| 工作温度 | -40C to +100C (Industrial) | Commercial (0C to +85C) |
| 封装 | 780-BBGA, FCBGA (HBGA-780) | 780-ball HBGA / FCBGA |
| 安装类型 | Surface Mount | Surface Mount |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Lead-Free / RoHS | Compliant (lead-free) | — |
| Adaptive Logic Modules (ALMs) | — | 80,000 |
| Embedded Memory Bits | — | 10,901,504 |
| Maximum Internal Frequency | — | 800 MHz |
| Speed Grade | — | C2 |
| Transceivers | — | Per family capability - not specified for this OPN |
| Package Code | — | PBGA780 / HBGA-780 |
| Lead Free | — | Yes |
| RoHS 状态 | — | Compliant |