EP3SL200H780I3 vs EP3SL200H780I4 Vergleich
Detaillierter Direktvergleich von EP3SL200H780I3 von Intel und EP3SL200H780I4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL200H780I3 | EP3SL200H780I4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7.980,00 | $6.255,75 |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III | Stratix III |
| Logic Elements | 200,000 | — |
| LABs (Logic Array Blocks) | 8000 | — |
| Total RAM Bits | 10,901,504 (10,900 Kb) | — |
| User I/O Count | 488 | 488 |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | — |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | — |
| PLLs | 12 | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 717 MHz | — |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Gehäuse | 780-BBGA, FCBGA (HBGA-780) | — |
| Montageart | Surface Mount | — |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Lead-Free / RoHS | Compliant (lead-free) | — |
| Logic Elements (LE) | — | 200,000 |
| Logic Array Blocks (LABs) | — | 8000 |
| Embedded Memory Bits | — | 10,901,504 |
| DSP Multipliers (18x18) | — | 384 |
| Voltage - Core Supply | — | 1.1 V |
| Package Type | — | 780-BBGA / FCBGA (FC-HFBGA) |
| Package Dimensions | — | 33 mm x 33 mm |
| Speed Grade | — | I4 (industrial) |
| Betriebs-Sperrschichttemperatur | — | -40C to +100C (industrial) |
| Configuration Memory | — | SRAM-based, volatile |
| RoHS-Status | — | Compliant |
| Design Tool | — | Quartus II (legacy) / Quartus Prime |