EP3SL200H780I4L vs EP3SL200H780I3N Vergleich
Detaillierter Direktvergleich von EP3SL200H780I4L von Intel und EP3SL200H780I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL200H780I4L | EP3SL200H780I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.395,00 | $7.200,00 |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 200,000 | 200,000 |
| Logic Array Blocks (LABs) | 8,000 | — |
| Embedded Memory (Bits) | 10,901,504 | — |
| Maximum User I/O | 488 | — |
| Core Supply Voltage | 0.86 V to 1.15 V | — |
| Process Technology | 65 nm CMOS | — |
| Internal Performance | 375 MHz | — |
| Gehäuse | 780-pin FC-HFBGA (Flip-Chip) | 780-BBGA, FCBGA |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Transceivers | Up to 24 channels | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| DSP Blocks | 9x9 / 18x18 / 36x36 multipliers | — |
| Memory Interface Support | DDR3, DDR2, DDR, QDR II+, RLDRAM II | — |
| JTAG Support | IEEE Std 1149.1 Boundary-Scan | — |
| RoHS-Status | Compliant | Compliant |
| Speed Grade | I4 (Industrial) | — |
| HardCopy Support | Compatible (Lattice-style migration path via HardCopy III) | — |
| RAM Bits | — | 10,901,504 |
| User I/O | — | 488 |
| Package Pin Count | — | 780 |
| Supply Voltage (Core) | — | 0.9 V |
| Technology | — | CMOS, 40 nm |
| Process Node | — | 40 nm |
| Number of Terminals | — | 780 |
| Case / Package Code | — | BGA-780 |
| Lead-Free | — | Yes |