EP3SL200H780I4L vs EP3SL200H780I3N Comparación
Comparación detallada lado a lado de EP3SL200H780I4L por Intel y EP3SL200H780I3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SL200H780I4L | EP3SL200H780I3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.395,00 | $7.200,00 |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 200,000 | 200,000 |
| Logic Array Blocks (LABs) | 8,000 | — |
| Embedded Memory (Bits) | 10,901,504 | — |
| Maximum User I/O | 488 | — |
| Core Supply Voltage | 0.86 V to 1.15 V | — |
| Process Technology | 65 nm CMOS | — |
| Internal Performance | 375 MHz | — |
| Encapsulado | 780-pin FC-HFBGA (Flip-Chip) | 780-BBGA, FCBGA |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Transceivers | Up to 24 channels | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| DSP Blocks | 9x9 / 18x18 / 36x36 multipliers | — |
| Memory Interface Support | DDR3, DDR2, DDR, QDR II+, RLDRAM II | — |
| JTAG Support | IEEE Std 1149.1 Boundary-Scan | — |
| Estado RoHS | Compliant | Compliant |
| Speed Grade | I4 (Industrial) | — |
| HardCopy Support | Compatible (Lattice-style migration path via HardCopy III) | — |
| RAM Bits | — | 10,901,504 |
| User I/O | — | 488 |
| Package Pin Count | — | 780 |
| Supply Voltage (Core) | — | 0.9 V |
| Technology | — | CMOS, 40 nm |
| Process Node | — | 40 nm |
| Number of Terminals | — | 780 |
| Case / Package Code | — | BGA-780 |
| Lead-Free | — | Yes |