EP3SL200H780I4LN vs EP3SL200H780C4L Vergleich
Detaillierter Direktvergleich von EP3SL200H780I4LN von Altera und EP3SL200H780C4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL200H780I4LN | EP3SL200H780C4L |
|---|---|---|
| Marke | Altera | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.280,00 | $6.459,35 |
| Series | Stratix III L | Stratix III |
| Family | Stratix III L (Low-Power) | — |
| Manufacturer | Intel / Altera (now Intel PSG) | Intel (formerly Altera) |
| Number of Logic Elements / Cells | 200,000 | — |
| Number of LABs / CLBs | 8,000 | — |
| Total RAM Bits | 10,901,504 (approximately 10.9 Mbit) | — |
| Number of I/O | 488 | — |
| Voltage - Supply | 0.9 V core (selectable Vcore) | — |
| Betriebstemperatur | -40C to +100C (industrial) | 0C to 85C (commercial) |
| Montageart | Surface Mount | — |
| Gehäuse / Bauform | 780-BBGA, FCBGA (Flip-Chip BGA) | — |
| Process Technology | 65 nm CMOS | TSMC 40 nm |
| Speed Grade | I4 (Industrial, mid-speed grade) | -4 (medium performance, commercial) |
| RoHS-Status | RoHS Compliant (lead-free) | Compliant |
| MSL-Level | MSL 3 (168 Hours, per JEDEC J-STD-020) | — |
| Roaming Pin Name Suffix | LN = lead-free, industrial temp, H780 780-ball package | — |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Logic Elements | — | 200,000 |
| Embedded Memory | — | 6.5 Mbit |
| User I/O Count | — | 488 |
| Package Type | — | 780-ball FCBGA (FineLine BGA, HBGA) |
| Package Code | — | BGA-780 / PBGA780 / HBGA-780 |
| Package Mounting | — | Surface Mount |
| Internal Logic Frequency | — | up to 717 MHz (per ampheo datasheet brief) |
| Lead-Free / Pb-Free | — | Yes (L suffix, lead-free) |
| Configuration Modes | — | FPP, AS, PS, JTAG |