EP3SL200H780I4N vs EP3SL200H780I4LN Vergleich
Detaillierter Direktvergleich von EP3SL200H780I4N von Intel und EP3SL200H780I4LN von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel
EP3SL200H780I4N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SL200H780I4N | EP3SL200H780I4LN |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4.750,00 | $1.280,00 |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III (Logic-rich variant) | Stratix III L (Low-Power) |
| Logic Elements | 200,000 | — |
| Logic Array Blocks (LABs) | 8,000 | — |
| Embedded Memory (bits) | 10,901,504 | — |
| User I/Os | 488 | — |
| Core Voltage | 1.1 V (0.86 V to 1.15 V range) | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Fabric Frequency (typical) | 450 MHz | — |
| Speed Grade | I4 | I4 (Industrial, mid-speed grade) |
| Betriebstemperaturbereich | -40C to +100C (industrial) | — |
| Gehäuse | 780-ball FCBGA (Flip-Chip BGA, FineLine) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Lead-Free | Yes (suffix N) | — |
| RoHS-Status | Compliant | RoHS Compliant (lead-free) |
| Manufacturer | — | Intel / Altera (now Intel PSG) |
| Number of Logic Elements / Cells | — | 200,000 |
| Number of LABs / CLBs | — | 8,000 |
| Total RAM Bits | — | 10,901,504 (approximately 10.9 Mbit) |
| Number of I/O | — | 488 |
| Voltage - Supply | — | 0.9 V core (selectable Vcore) |
| Betriebstemperatur | — | -40C to +100C (industrial) |
| Gehäuse / Bauform | — | 780-BBGA, FCBGA (Flip-Chip BGA) |
| MSL-Level | — | MSL 3 (168 Hours, per JEDEC J-STD-020) |
| Roaming Pin Name Suffix | — | LN = lead-free, industrial temp, H780 780-ball package |