EP3SL200H780I4N vs EP3SL200H780I4LN Comparación
Comparación detallada lado a lado de EP3SL200H780I4N por Intel y EP3SL200H780I4LN por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SL200H780I4N | EP3SL200H780I4LN |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4.750,00 | $1.280,00 |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III (Logic-rich variant) | Stratix III L (Low-Power) |
| Logic Elements | 200,000 | — |
| Logic Array Blocks (LABs) | 8,000 | — |
| Embedded Memory (bits) | 10,901,504 | — |
| User I/Os | 488 | — |
| Core Voltage | 1.1 V (0.86 V to 1.15 V range) | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Fabric Frequency (typical) | 450 MHz | — |
| Speed Grade | I4 | I4 (Industrial, mid-speed grade) |
| Rango de temperatura de funcionamiento | -40C to +100C (industrial) | — |
| Encapsulado | 780-ball FCBGA (Flip-Chip BGA, FineLine) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Lead-Free | Yes (suffix N) | — |
| Estado RoHS | Compliant | RoHS Compliant (lead-free) |
| Manufacturer | — | Intel / Altera (now Intel PSG) |
| Number of Logic Elements / Cells | — | 200,000 |
| Number of LABs / CLBs | — | 8,000 |
| Total RAM Bits | — | 10,901,504 (approximately 10.9 Mbit) |
| Number of I/O | — | 488 |
| Voltage - Supply | — | 0.9 V core (selectable Vcore) |
| Temperatura de funcionamiento | — | -40C to +100C (industrial) |
| Encapsulado / Carcasa | — | 780-BBGA, FCBGA (Flip-Chip BGA) |
| Nivel MSL | — | MSL 3 (168 Hours, per JEDEC J-STD-020) |
| Roaming Pin Name Suffix | — | LN = lead-free, industrial temp, H780 780-ball package |