EP3SL340F1760C2 vs EP3SL340F1760I3 Vergleich
Detaillierter Direktvergleich von EP3SL340F1760C2 von Intel und EP3SL340F1760I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
EP3SL340F1760I3 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SL340F1760C2 | EP3SL340F1760I3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $18.500,00 | $1.450,00 |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III | — |
| Logic Elements (LE) | 337,500 | — |
| Logic Array Blocks (LABs) | 13,500 | — |
| Embedded Memory (bits) | 18,822,144 | — |
| User I/O Count | 1,120 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: 18x18 multiplier count] |
| Transceivers | [DATA_NEEDED: transceiver count and max data rate] | [DATA_NEEDED: transceiver count and data rate for this F1760 variant] |
| Maximum User I/O Voltage | 3.3 V (LVTTL/LVCMOS supporting up to 3.0 V LVDS) | — |
| Core Voltage | 0.9 V / 1.1 V | 1.1 V |
| Process Node | 40 nm TSMC | — |
| Gehäuse | 1760-ball FCBGA (FineLine BGA) | — |
| Ball Pitch | 1.0 mm | — |
| Betriebstemperatur | 0C to +85C (Commercial, C2 suffix) | -40 °C to 100 °C (Industrial grade, I3 suffix) |
| RoHS-Status | Compliant | Compliant (Pb-free BGA balls) |
| Configuration | SRAM-based, supports JTAG, FPP, AS, PS | — |
| Programmable Power Technology | Yes | — |
| PCIe Hard IP | Yes (Gen1/Gen2) | — |
| Logic Elements | — | 337,500 LE |
| LABs (Logic Array Blocks) | — | 13,500 |
| Embedded Memory Bits | — | 18,822,144 bit |
| User I/Os | — | 1120 |
| Number of Pins / Balls | — | 1760 |
| Package Type | — | FC-FBGA (1760-ball, FineLine BGA) |
| Package Code | — | BGA1760, 42x42, 40 |
| Process Technology | — | 65 nm |
| Speed Grade | — | I3 (Industrial, mid-speed bin) |
| Montageart | — | Surface Mount |
| Configuration Memory | — | SRAM-based, volatile (requires external configuration device) |
| PLLs | — | [DATA_NEEDED: PLL count] |
| MSL-Level | — | MSL3 (JEDEC J-STD-020, reflow 245 °C peak) |