EP3SL340F1760C2 vs EP3SL340F1760I3 Comparación
Comparación detallada lado a lado de EP3SL340F1760C2 por Intel y EP3SL340F1760I3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
EP3SL340F1760I3 ⚠ Última compraComparación de especificaciones
| Parámetro | EP3SL340F1760C2 | EP3SL340F1760I3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $18.500,00 | $1.450,00 |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III | — |
| Logic Elements (LE) | 337,500 | — |
| Logic Array Blocks (LABs) | 13,500 | — |
| Embedded Memory (bits) | 18,822,144 | — |
| User I/O Count | 1,120 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: 18x18 multiplier count] |
| Transceivers | [DATA_NEEDED: transceiver count and max data rate] | [DATA_NEEDED: transceiver count and data rate for this F1760 variant] |
| Maximum User I/O Voltage | 3.3 V (LVTTL/LVCMOS supporting up to 3.0 V LVDS) | — |
| Core Voltage | 0.9 V / 1.1 V | 1.1 V |
| Process Node | 40 nm TSMC | — |
| Encapsulado | 1760-ball FCBGA (FineLine BGA) | — |
| Ball Pitch | 1.0 mm | — |
| Temperatura de funcionamiento | 0C to +85C (Commercial, C2 suffix) | -40 °C to 100 °C (Industrial grade, I3 suffix) |
| Estado RoHS | Compliant | Compliant (Pb-free BGA balls) |
| Configuration | SRAM-based, supports JTAG, FPP, AS, PS | — |
| Programmable Power Technology | Yes | — |
| PCIe Hard IP | Yes (Gen1/Gen2) | — |
| Logic Elements | — | 337,500 LE |
| LABs (Logic Array Blocks) | — | 13,500 |
| Embedded Memory Bits | — | 18,822,144 bit |
| User I/Os | — | 1120 |
| Number of Pins / Balls | — | 1760 |
| Package Type | — | FC-FBGA (1760-ball, FineLine BGA) |
| Package Code | — | BGA1760, 42x42, 40 |
| Process Technology | — | 65 nm |
| Speed Grade | — | I3 (Industrial, mid-speed bin) |
| Tipo de montaje | — | Surface Mount |
| Configuration Memory | — | SRAM-based, volatile (requires external configuration device) |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Nivel MSL | — | MSL3 (JEDEC J-STD-020, reflow 245 °C peak) |