EP3SL340F1760C2 vs EP3SL340F1760I3 Comparaison
Comparaison détaillée côte à côte de EP3SL340F1760C2 par Intel et EP3SL340F1760I3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
EP3SL340F1760I3 ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP3SL340F1760C2 | EP3SL340F1760I3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $18 500,00 | $1 450,00 |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III | — |
| Logic Elements (LE) | 337,500 | — |
| Logic Array Blocks (LABs) | 13,500 | — |
| Embedded Memory (bits) | 18,822,144 | — |
| User I/O Count | 1,120 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: 18x18 multiplier count] |
| Transceivers | [DATA_NEEDED: transceiver count and max data rate] | [DATA_NEEDED: transceiver count and data rate for this F1760 variant] |
| Maximum User I/O Voltage | 3.3 V (LVTTL/LVCMOS supporting up to 3.0 V LVDS) | — |
| Core Voltage | 0.9 V / 1.1 V | 1.1 V |
| Process Node | 40 nm TSMC | — |
| Boîtier | 1760-ball FCBGA (FineLine BGA) | — |
| Ball Pitch | 1.0 mm | — |
| Température de fonctionnement | 0C to +85C (Commercial, C2 suffix) | -40 °C to 100 °C (Industrial grade, I3 suffix) |
| Statut RoHS | Compliant | Compliant (Pb-free BGA balls) |
| Configuration | SRAM-based, supports JTAG, FPP, AS, PS | — |
| Programmable Power Technology | Yes | — |
| PCIe Hard IP | Yes (Gen1/Gen2) | — |
| Logic Elements | — | 337,500 LE |
| LABs (Logic Array Blocks) | — | 13,500 |
| Embedded Memory Bits | — | 18,822,144 bit |
| User I/Os | — | 1120 |
| Number of Pins / Balls | — | 1760 |
| Package Type | — | FC-FBGA (1760-ball, FineLine BGA) |
| Package Code | — | BGA1760, 42x42, 40 |
| Process Technology | — | 65 nm |
| Speed Grade | — | I3 (Industrial, mid-speed bin) |
| Type de montage | — | Surface Mount |
| Configuration Memory | — | SRAM-based, volatile (requires external configuration device) |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Niveau MSL | — | MSL3 (JEDEC J-STD-020, reflow 245 °C peak) |