EP3SL50F484I3 vs EP3SE50F484I3 Vergleich

Detaillierter Direktvergleich von EP3SL50F484I3 von Intel und EP3SE50F484I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SL50F484I3 EP3SE50F484I3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $701,23 $188,00
Family Stratix III L (Low Power) Stratix III E
Device Logic Elements 47,500 —
Embedded Memory (bits) 2,184,192 —
Logic Array Blocks (LABs) 1,900 1,900
Maximum User I/O 296 —
Gehäuse 484-ball FC-FBGA (Flip-Chip FineLine BGA) 484-ball FCBGA (FineLine BGA), 1.0 mm pitch
Process Technology 65 nm 65 nm
Core Voltage 1.1 V 1.1 V
Internal Operating Frequency 500 MHz —
Betriebstemperatur 0 °C to +85 °C (commercial) —
Montageart Surface Mount Surface Mount (BGA)
Lead-Free / RoHS [DATA_NEEDED: lead-free/RoHS status] —
MSL-Level [DATA_NEEDED: MSL level] —
Configuration Scheme SRAM-based (volatile, requires external config device) —
Transceivers Stratix III L — supports high-speed serial transceivers per family datasheet Multi-gigabit transceivers supported
Logic Elements — 47,500
Embedded Memory — 5,760 Kbits
User I/Os — 296
Operating Temperature Grade — Industrial (-40 °C to +100 °C)
Speed Grade — I3 (-3 speed bin, industrial)
DSP Blocks — Yes (embedded multipliers and accumulators)
Configuration Modes — AS, PS, FPP, JTAG
PLLs — Yes (multiple, for clock management)
I/O Standards — LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X
RoHS-Status — Compliant
Lead-Free — Yes

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