EP3SL50F484I3 vs EP3SL50F484I4 Vergleich

Detaillierter Direktvergleich von EP3SL50F484I3 von Intel und EP3SL50F484I4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SL50F484I3 EP3SL50F484I4
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $701,23 $558,00
Family Stratix III L (Low Power) —
Device Logic Elements 47,500 —
Embedded Memory (bits) 2,184,192 —
Logic Array Blocks (LABs) 1,900 1,900
Maximum User I/O 296 296
Gehäuse 484-ball FC-FBGA (Flip-Chip FineLine BGA) 484-ball FC-FBGA (FCBGA, 1.0 mm pitch)
Process Technology 65 nm 65 nm CMOS
Core Voltage 1.1 V —
Internal Operating Frequency 500 MHz —
Betriebstemperatur 0 °C to +85 °C (commercial) -40C to +100C (industrial)
Montageart Surface Mount Surface Mount (BGA)
Lead-Free / RoHS [DATA_NEEDED: lead-free/RoHS status] —
MSL-Level [DATA_NEEDED: MSL level] 3 (168 hours)
Configuration Scheme SRAM-based (volatile, requires external config device) —
Transceivers Stratix III L — supports high-speed serial transceivers per family datasheet —
Device Family — Stratix III L
Logic Elements (LE) — 47,500
Embedded Memory Bits — 2,184,192 bits
Internal Frequency — 800 MHz (max, per digchip datasheet summary)
Core Supply Voltage — 1.1 V
Grade Suffix — I4 = Industrial, speed grade 4
Configuration Modes — JTAG, Passive Serial, FPP, PPA
MultiTrack Interconnect — Yes
TriMatrix Embedded Memory — MLAB, M9K, M144K blocks
RoHS-Status — Compliant
Lead-Free — Yes

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern