EP3SL50F780C3 vs EP3SL50F780C2N Vergleich
Detaillierter Direktvergleich von EP3SL50F780C3 von Intel und EP3SL50F780C2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera
EP3SL50F780C3 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SL50F780C3 | EP3SL50F780C2N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $540,00 | $312,00 |
| Family | Stratix III L (low-power) | — |
| Series | Stratix III | Stratix III L |
| Logic Elements | 47,500 | 47,500 |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory Bits | 2,184,192 | — |
| User I/Os | 488 | 488 |
| Package Type | 780-BBGA, FCBGA (FineLine) | — |
| Device Pin Count | 780 | — |
| Betriebstemperatur | 0C to +85C (Commercial) | 0 °C to 85 °C (Commercial) |
| Speed Grade | 3 | C2 |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT nominal value] | — |
| PLLs | 12 | — |
| Global Clock Networks | 24 | — |
| Process Node | 65 nm TSMC | — |
| Configuration Method | SRAM-based, supports Partial Reconfiguration | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free / Halogen-Free | Lead-Free (per package marking); Halogen-Free status unknown | — |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | MSL3 (per JEDEC J-STD-020, typical for large FBGA) | — |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Configurable Logic Blocks (LABs) | — | 1,900 |
| Embedded Memory | — | 2,184,192 bits |
| Gehäuse | — | 780-ball FBGA (FCBGA) |
| Internal Fabric Frequency (max) | — | 800 MHz |
| Process Technology | — | 65 nm |
| Core Supply Voltage | — | 0.9 V |
| Montageart | — | Surface Mount |
| Lebenszyklusstatus | — | Not Recommended for New Designs (NRND) |