EP3SL50F780C3G vs EP3SE50F780C3 Vergleich
Detaillierter Direktvergleich von EP3SL50F780C3G von Intel und EP3SE50F780C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SL50F780C3G - Stratix III L FPGA, 47.5K LE, 488 I/O, 780-FBGA | Altera / Intel
EP3SL50F780C3G ✓ Aktiv
Spezifikationsvergleich
| Parameter | EP3SL50F780C3G | EP3SE50F780C3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $625,00 | $890,00 |
| Family | Stratix III L | Stratix III E |
| Logic Elements (LE) | 47,500 | 47,500 |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory (bits) | 2,184,192 | — |
| Distributed RAM | 2.08 Mbit | — |
| User I/O Count | 488 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (Commercial grade, 'C' suffix) |
| Temperature Grade Suffix | C (commercial, "3" speed grade) | — |
| Gehäuse | 780-ball FBGA | 780-ball FC-FBGA (FineLine BGA) |
| Montageart | SMD/SMT | Surface Mount (BGA) |
| Packaging | Tray | — |
| Process Technology | TSMC 40 nm low-power | 65 nm |
| Configuration Method | SRAM-based, JTAG/AS configuration | — |
| Design Software | Intel Quartus II (v9.0+) | — |
| RoHS-Status | Compliant (per DigiKey listing) | [DATA_NEEDED: RoHS status] |
| Embedded Memory (BRAM) | — | 5,760 Kbits |
| User I/Os | — | 488 |
| Logic Voltage | — | 0.9 V |
| Transceiver Speed (max) | — | 500 MHz |
| Total LABs/CLBs | — | 1900 |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| MSL-Level | — | [DATA_NEEDED: MSL level] |