EP3SL50F780C3G vs EP3SE50F780C3 对比
详细并排对比 EP3SL50F780C3G 出自 Intel 和 EP3SE50F780C3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EP3SL50F780C3G - Stratix III L FPGA, 47.5K LE, 488 I/O, 780-FBGA | Altera / Intel
EP3SL50F780C3G ✓ 量产中
规格对比
| 参数 | EP3SL50F780C3G | EP3SE50F780C3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $625.00 | $890.00 |
| Family | Stratix III L | Stratix III E |
| Logic Elements (LE) | 47,500 | 47,500 |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory (bits) | 2,184,192 | — |
| Distributed RAM | 2.08 Mbit | — |
| User I/O Count | 488 | — |
| Core Voltage | 1.1 V | 1.1 V |
| 工作温度 | 0C to +85C (commercial) | 0C to +85C (Commercial grade, 'C' suffix) |
| Temperature Grade Suffix | C (commercial, "3" speed grade) | — |
| 封装 | 780-ball FBGA | 780-ball FC-FBGA (FineLine BGA) |
| 安装类型 | SMD/SMT | Surface Mount (BGA) |
| Packaging | Tray | — |
| Process Technology | TSMC 40 nm low-power | 65 nm |
| Configuration Method | SRAM-based, JTAG/AS configuration | — |
| Design Software | Intel Quartus II (v9.0+) | — |
| RoHS 状态 | Compliant (per DigiKey listing) | [DATA_NEEDED: RoHS status] |
| Embedded Memory (BRAM) | — | 5,760 Kbits |
| User I/Os | — | 488 |
| Logic Voltage | — | 0.9 V |
| Transceiver Speed (max) | — | 500 MHz |
| Total LABs/CLBs | — | 1900 |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |