EP3SL70F484I3 vs EP3SL70F484C2 Vergleich
Detaillierter Direktvergleich von EP3SL70F484I3 von Intel und EP3SL70F484C2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SL70F484I3 - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel
EP3SL70F484I3 ⚠ Letzte Bestellmöglichkeit
Spezifikationsvergleich
| Parameter | EP3SL70F484I3 | EP3SL70F484C2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.013,66 | $980,00 |
| Family | Stratix III L | Stratix III L FPGA |
| Logic Elements | 67,500 | 67,500 |
| Adaptive Logic Modules (ALMs) | 33,000 | — |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| Total Embedded Memory | 2,699,264 bits (337 KB) | — |
| M9K Memory Blocks | 288 | — |
| M144K Memory Blocks | 12 | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| User I/O Pins | 296 | — |
| Transceivers | Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] | — |
| PLLs | 8 (4 enhanced PLLs + 4 fast PLLs) | — |
| Process Node | TSMC 40 nm | — |
| Speed Grade | -3 (mid-tier) | C2 |
| Betriebstemperatur | -40C to +100C (industrial) | 0C to +85C (Commercial) |
| Gehäuse | 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch | — |
| Configuration Modes | FPP, AS, PS, JTAG, AES encryption | — |
| Design Software | Quartus II (legacy) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Series | — | Stratix III L |
| Embedded Memory | — | 2,699,264 bits |
| User I/O Count | — | 296 |
| Core Voltage | — | 1.1 V |
| Process Technology | — | 65 nm |
| Maximum Core Frequency | — | 600 MHz |
| Package Type | — | 484-ball FC-FBGA (FineLine BGA) |
| Package Pin Count | — | 484 |
| Montageart | — | Surface Mount |