EP3SL70F484I3 vs EP3SL70F484C2 Comparación
Comparación detallada lado a lado de EP3SL70F484I3 por Intel y EP3SL70F484C2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SL70F484I3 | EP3SL70F484C2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.013,66 | $980,00 |
| Family | Stratix III L | Stratix III L FPGA |
| Logic Elements | 67,500 | 67,500 |
| Adaptive Logic Modules (ALMs) | 33,000 | — |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| Total Embedded Memory | 2,699,264 bits (337 KB) | — |
| M9K Memory Blocks | 288 | — |
| M144K Memory Blocks | 12 | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| User I/O Pins | 296 | — |
| Transceivers | Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] | — |
| PLLs | 8 (4 enhanced PLLs + 4 fast PLLs) | — |
| Process Node | TSMC 40 nm | — |
| Speed Grade | -3 (mid-tier) | C2 |
| Temperatura de funcionamiento | -40C to +100C (industrial) | 0C to +85C (Commercial) |
| Encapsulado | 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch | — |
| Configuration Modes | FPP, AS, PS, JTAG, AES encryption | — |
| Design Software | Quartus II (legacy) | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Series | — | Stratix III L |
| Embedded Memory | — | 2,699,264 bits |
| User I/O Count | — | 296 |
| Core Voltage | — | 1.1 V |
| Process Technology | — | 65 nm |
| Maximum Core Frequency | — | 600 MHz |
| Package Type | — | 484-ball FC-FBGA (FineLine BGA) |
| Package Pin Count | — | 484 |
| Tipo de montaje | — | Surface Mount |