EP3SL70F484I3N vs EP3SL70F484I3 Vergleich
Detaillierter Direktvergleich von EP3SL70F484I3N von Intel und EP3SL70F484I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SL70F484I3 - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel
EP3SL70F484I3 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SL70F484I3N | EP3SL70F484I3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $995,40 | $1.013,66 |
| Series | Stratix III L | — |
| Logic Elements / Cells | 67,500 | — |
| Number of LABs / CLBs | 2,700 | — |
| Total RAM Bits | 2,699,264 | — |
| Number of I/O | 296 | — |
| Gehäuse / Bauform | 484-BBGA, FCBGA | — |
| Supplier Device Package | 484-FBGA (23x23 mm) | — |
| Montageart | Surface Mount | — |
| Betriebstemperatur | -40C to +100C (TJ) | -40C to +100C (industrial) |
| Voltage - Supply | [DATA_NEEDED: core and I/O supply voltages] | — |
| Process Technology | 40 nm CMOS | — |
| DSP Blocks | [DATA_NEEDED: exact count for EP3SL70] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count for this speed grade] | — |
| Product Status | Obsolete (per Assypcb listing) | — |
| RoHS-Status | [DATA_NEEDED: per datasheet] | Compliant |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | [DATA_NEEDED: MSL rating] | — |
| Speed Grade | 3 | -3 (mid-tier) |
| Temperature Grade | Industrial (I) | — |
| Family | — | Stratix III L |
| Logic Elements | — | 67,500 |
| Adaptive Logic Modules (ALMs) | — | 33,000 |
| Logic Array Blocks (LABs) | — | 2,700 |
| Total Embedded Memory | — | 2,699,264 bits (337 KB) |
| M9K Memory Blocks | — | 288 |
| M144K Memory Blocks | — | 12 |
| DSP Blocks (18x18 multipliers) | — | 384 |
| User I/O Pins | — | 296 |
| Transceivers | — | Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] |
| PLLs | — | 8 (4 enhanced PLLs + 4 fast PLLs) |
| Process Node | — | TSMC 40 nm |
| Gehäuse | — | 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch |
| Configuration Modes | — | FPP, AS, PS, JTAG, AES encryption |
| Design Software | — | Quartus II (legacy) |