EP3SL70F484I3N vs EP3SL70F484I3 Comparaison
Comparaison détaillée côte à côte de EP3SL70F484I3N par Intel et EP3SL70F484I3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3SL70F484I3N | EP3SL70F484I3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $995,40 | $1 013,66 |
| Series | Stratix III L | — |
| Logic Elements / Cells | 67,500 | — |
| Number of LABs / CLBs | 2,700 | — |
| Total RAM Bits | 2,699,264 | — |
| Number of I/O | 296 | — |
| Boîtier / Format | 484-BBGA, FCBGA | — |
| Supplier Device Package | 484-FBGA (23x23 mm) | — |
| Type de montage | Surface Mount | — |
| Température de fonctionnement | -40C to +100C (TJ) | -40C to +100C (industrial) |
| Voltage - Supply | [DATA_NEEDED: core and I/O supply voltages] | — |
| Process Technology | 40 nm CMOS | — |
| DSP Blocks | [DATA_NEEDED: exact count for EP3SL70] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count for this speed grade] | — |
| Product Status | Obsolete (per Assypcb listing) | — |
| Statut RoHS | [DATA_NEEDED: per datasheet] | Compliant |
| Niveau de sensibilité à l'humidité (MSL) | [DATA_NEEDED: MSL rating] | — |
| Speed Grade | 3 | -3 (mid-tier) |
| Temperature Grade | Industrial (I) | — |
| Family | — | Stratix III L |
| Logic Elements | — | 67,500 |
| Adaptive Logic Modules (ALMs) | — | 33,000 |
| Logic Array Blocks (LABs) | — | 2,700 |
| Total Embedded Memory | — | 2,699,264 bits (337 KB) |
| M9K Memory Blocks | — | 288 |
| M144K Memory Blocks | — | 12 |
| DSP Blocks (18x18 multipliers) | — | 384 |
| User I/O Pins | — | 296 |
| Transceivers | — | Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] |
| PLLs | — | 8 (4 enhanced PLLs + 4 fast PLLs) |
| Process Node | — | TSMC 40 nm |
| Boîtier | — | 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch |
| Configuration Modes | — | FPP, AS, PS, JTAG, AES encryption |
| Design Software | — | Quartus II (legacy) |