EP3SL70F484I3N vs EP3SL70F484I3 Comparación
Comparación detallada lado a lado de EP3SL70F484I3N por Intel y EP3SL70F484I3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SL70F484I3N | EP3SL70F484I3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $995,40 | $1.013,66 |
| Series | Stratix III L | — |
| Logic Elements / Cells | 67,500 | — |
| Number of LABs / CLBs | 2,700 | — |
| Total RAM Bits | 2,699,264 | — |
| Number of I/O | 296 | — |
| Encapsulado / Carcasa | 484-BBGA, FCBGA | — |
| Supplier Device Package | 484-FBGA (23x23 mm) | — |
| Tipo de montaje | Surface Mount | — |
| Temperatura de funcionamiento | -40C to +100C (TJ) | -40C to +100C (industrial) |
| Voltage - Supply | [DATA_NEEDED: core and I/O supply voltages] | — |
| Process Technology | 40 nm CMOS | — |
| DSP Blocks | [DATA_NEEDED: exact count for EP3SL70] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count for this speed grade] | — |
| Product Status | Obsolete (per Assypcb listing) | — |
| Estado RoHS | [DATA_NEEDED: per datasheet] | Compliant |
| Nivel de sensibilidad a la humedad (MSL) | [DATA_NEEDED: MSL rating] | — |
| Speed Grade | 3 | -3 (mid-tier) |
| Temperature Grade | Industrial (I) | — |
| Family | — | Stratix III L |
| Logic Elements | — | 67,500 |
| Adaptive Logic Modules (ALMs) | — | 33,000 |
| Logic Array Blocks (LABs) | — | 2,700 |
| Total Embedded Memory | — | 2,699,264 bits (337 KB) |
| M9K Memory Blocks | — | 288 |
| M144K Memory Blocks | — | 12 |
| DSP Blocks (18x18 multipliers) | — | 384 |
| User I/O Pins | — | 296 |
| Transceivers | — | Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] |
| PLLs | — | 8 (4 enhanced PLLs + 4 fast PLLs) |
| Process Node | — | TSMC 40 nm |
| Encapsulado | — | 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch |
| Configuration Modes | — | FPP, AS, PS, JTAG, AES encryption |
| Design Software | — | Quartus II (legacy) |