EP3SL70F780C2G vs EP3SL50F780C2 Vergleich
Detaillierter Direktvergleich von EP3SL70F780C2G von Intel und EP3SL50F780C2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL70F780C2G | EP3SL50F780C2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.185,00 | $199,95 |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | — |
| Embedded Memory | 2,699,264 bits | — |
| User I/O Count | 488 | — |
| Gehäuse | 780-ball FCBGA (FineLine BGA) | 780-ball FCBGA (Flip-Chip BGA) |
| Speed Grade | C2 (medium) | — |
| Temperature Grade | Commercial (0 C to 85 C) | — |
| Process Node | 40 nm low-power CMOS | — |
| Core Voltage (VCC) | 0.9 V | — |
| DSP Blocks | Yes (dedicated) | — |
| Memory Interfaces Supported | DDR3, DDR2, QDR II+, RLDRAM II | — |
| PCIe Hard IP | Gen1/Gen2 | — |
| Transceivers | [DATA_NEEDED: transceiver count and data rate] | — |
| PLLs | Fractional PLLs | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| Logic Elements (LE) | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory (bits) | — | 2,184,192 |
| Maximum User I/Os | — | 488 |
| Core Voltage | — | 1.1 V |
| Process Technology | — | 65 nm |
| Betriebstemperatur | — | 0°C to +85°C (commercial) |
| Maximum Core Frequency | — | 600 MHz |
| Configuration Interface | — | JTAG / passive serial / fast passive parallel |
| I/O Standards | — | LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces |
| Embedded Memory Type | — | TriMatrix (MLAB, M9K, M144K blocks) |