EP3SL70F780C2G vs EP3SL50F780C2 Comparación
Comparación detallada lado a lado de EP3SL70F780C2G por Intel y EP3SL50F780C2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SL70F780C2G | EP3SL50F780C2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.185,00 | $199,95 |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | — |
| Embedded Memory | 2,699,264 bits | — |
| User I/O Count | 488 | — |
| Encapsulado | 780-ball FCBGA (FineLine BGA) | 780-ball FCBGA (Flip-Chip BGA) |
| Speed Grade | C2 (medium) | — |
| Temperature Grade | Commercial (0 C to 85 C) | — |
| Process Node | 40 nm low-power CMOS | — |
| Core Voltage (VCC) | 0.9 V | — |
| DSP Blocks | Yes (dedicated) | — |
| Memory Interfaces Supported | DDR3, DDR2, QDR II+, RLDRAM II | — |
| PCIe Hard IP | Gen1/Gen2 | — |
| Transceivers | [DATA_NEEDED: transceiver count and data rate] | — |
| PLLs | Fractional PLLs | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory (bits) | — | 2,184,192 |
| Maximum User I/Os | — | 488 |
| Core Voltage | — | 1.1 V |
| Process Technology | — | 65 nm |
| Temperatura de funcionamiento | — | 0°C to +85°C (commercial) |
| Maximum Core Frequency | — | 600 MHz |
| Configuration Interface | — | JTAG / passive serial / fast passive parallel |
| I/O Standards | — | LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces |
| Embedded Memory Type | — | TriMatrix (MLAB, M9K, M144K blocks) |