EP3SL70F780C4L vs EP3SL70F780C2N Vergleich
Detaillierter Direktvergleich von EP3SL70F780C4L von Intel und EP3SL70F780C2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL70F780C4L | EP3SL70F780C2N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $944,74 | $139,00 |
| Manufacturer | Intel (formerly Altera) | Intel (formerly Altera) |
| Series | Stratix III L | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements (LE) | 67,500 | — |
| Total Memory Bits | 2,699,264 bits (~2.7 Mb) | — |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| Maximum User I/O | 488 | — |
| Process Technology | 65 nm | 65 nm CMOS, low-power variant |
| Internal Frequency (max) | [DATA_NEEDED: internal frequency] | — |
| Core Voltage (VCC) | 0.9 V | — |
| Speed Grade | C4 | C2 (commercial, -2 speed bin) |
| Betriebstemperatur | 0C to 85C (commercial) | — |
| Package Type | 780-BBGA, FC-FBGA (Flip-Chip) | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Lead Free / RoHS | Yes (lead-free per BGA package) | — |
| Configuration Method | JTAG, Passive Serial, FPP, external memory | — |
| Design Software | Quartus II (Stratix III device support) | — |
| Family | — | Stratix III L |
| Logic Elements | — | 67,500 |
| Embedded Memory Bits | — | 2,699,264 |
| Embedded Memory Type | — | M9K blocks |
| User I/Os | — | 488 |
| Core Voltage | — | 1.1 V |
| Maximum Logic Performance | — | 600 MHz |
| Gehäuse | — | 780-ball FC-FBGA (FineLine BGA) |
| Package Pin Count | — | 780 |
| Operating Temperature Grade | — | N suffix - standard commercial/other |
| RoHS-Status | — | Compliant (per DigiKey listing) |