EP3SL70F780C4L vs EP3SL70F780C2N Comparación
Comparación detallada lado a lado de EP3SL70F780C4L por Intel y EP3SL70F780C2N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SL70F780C4L | EP3SL70F780C2N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $944,74 | $139,00 |
| Manufacturer | Intel (formerly Altera) | Intel (formerly Altera) |
| Series | Stratix III L | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements (LE) | 67,500 | — |
| Total Memory Bits | 2,699,264 bits (~2.7 Mb) | — |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| Maximum User I/O | 488 | — |
| Process Technology | 65 nm | 65 nm CMOS, low-power variant |
| Internal Frequency (max) | [DATA_NEEDED: internal frequency] | — |
| Core Voltage (VCC) | 0.9 V | — |
| Speed Grade | C4 | C2 (commercial, -2 speed bin) |
| Temperatura de funcionamiento | 0C to 85C (commercial) | — |
| Package Type | 780-BBGA, FC-FBGA (Flip-Chip) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Lead Free / RoHS | Yes (lead-free per BGA package) | — |
| Configuration Method | JTAG, Passive Serial, FPP, external memory | — |
| Design Software | Quartus II (Stratix III device support) | — |
| Family | — | Stratix III L |
| Logic Elements | — | 67,500 |
| Embedded Memory Bits | — | 2,699,264 |
| Embedded Memory Type | — | M9K blocks |
| User I/Os | — | 488 |
| Core Voltage | — | 1.1 V |
| Maximum Logic Performance | — | 600 MHz |
| Encapsulado | — | 780-ball FC-FBGA (FineLine BGA) |
| Package Pin Count | — | 780 |
| Operating Temperature Grade | — | N suffix - standard commercial/other |
| Estado RoHS | — | Compliant (per DigiKey listing) |