EP3SL70F780C4L vs EP3SL70F780C2N Comparaison
Comparaison détaillée côte à côte de EP3SL70F780C4L par Intel et EP3SL70F780C2N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3SL70F780C4L | EP3SL70F780C2N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $944,74 | $139,00 |
| Manufacturer | Intel (formerly Altera) | Intel (formerly Altera) |
| Series | Stratix III L | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements (LE) | 67,500 | — |
| Total Memory Bits | 2,699,264 bits (~2.7 Mb) | — |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| Maximum User I/O | 488 | — |
| Process Technology | 65 nm | 65 nm CMOS, low-power variant |
| Internal Frequency (max) | [DATA_NEEDED: internal frequency] | — |
| Core Voltage (VCC) | 0.9 V | — |
| Speed Grade | C4 | C2 (commercial, -2 speed bin) |
| Température de fonctionnement | 0C to 85C (commercial) | — |
| Package Type | 780-BBGA, FC-FBGA (Flip-Chip) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA) |
| Lead Free / RoHS | Yes (lead-free per BGA package) | — |
| Configuration Method | JTAG, Passive Serial, FPP, external memory | — |
| Design Software | Quartus II (Stratix III device support) | — |
| Family | — | Stratix III L |
| Logic Elements | — | 67,500 |
| Embedded Memory Bits | — | 2,699,264 |
| Embedded Memory Type | — | M9K blocks |
| User I/Os | — | 488 |
| Core Voltage | — | 1.1 V |
| Maximum Logic Performance | — | 600 MHz |
| Boîtier | — | 780-ball FC-FBGA (FineLine BGA) |
| Package Pin Count | — | 780 |
| Operating Temperature Grade | — | N suffix - standard commercial/other |
| Statut RoHS | — | Compliant (per DigiKey listing) |