EP3SL70F780C4L vs EP3SL70F780C3N Vergleich
Detaillierter Direktvergleich von EP3SL70F780C4L von Intel und EP3SL70F780C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL70F780C4L | EP3SL70F780C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $944,74 | $198,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III L | Stratix III L |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements (LE) | 67,500 | — |
| Total Memory Bits | 2,699,264 bits (~2.7 Mb) | — |
| Logic Array Blocks (LABs) | 2,700 | — |
| Maximum User I/O | 488 | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Internal Frequency (max) | [DATA_NEEDED: internal frequency] | — |
| Core Voltage (VCC) | 0.9 V | — |
| Speed Grade | C4 | — |
| Betriebstemperatur | 0C to 85C (commercial) | — |
| Package Type | 780-BBGA, FC-FBGA (Flip-Chip) | 780-ball FC-FBGA (29x29 mm) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Lead Free / RoHS | Yes (lead-free per BGA package) | — |
| Configuration Method | JTAG, Passive Serial, FPP, external memory | — |
| Design Software | Quartus II (Stratix III device support) | — |
| Logic Elements | — | 67,500 |
| Adaptive Logic Modules (ALMs) | — | 33,750 |
| Embedded Memory Bits | — | 2,699,264 bits (2.699 Mbit) |
| Embedded Multipliers (18x18) | — | 488 |
| Maximum Operating Frequency | — | 717 MHz |
| Core Voltage | — | 1.1 V |
| Number of I/O Banks | — | 8 |
| Anzahl der Pins | — | 780 |
| Betriebstemperaturbereich | — | Commercial (0C to +85C) |
| RoHS-Status | — | Compliant (lead-free FBGA) |
| MSL-Level | — | 3 (per JEDEC J-STD-020) |