EP3SL70F780C4L vs EP3SL70F780C3N Comparación
Comparación detallada lado a lado de EP3SL70F780C4L por Intel y EP3SL70F780C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SL70F780C4L | EP3SL70F780C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $944,74 | $198,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III L | Stratix III L |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements (LE) | 67,500 | — |
| Total Memory Bits | 2,699,264 bits (~2.7 Mb) | — |
| Logic Array Blocks (LABs) | 2,700 | — |
| Maximum User I/O | 488 | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Internal Frequency (max) | [DATA_NEEDED: internal frequency] | — |
| Core Voltage (VCC) | 0.9 V | — |
| Speed Grade | C4 | — |
| Temperatura de funcionamiento | 0C to 85C (commercial) | — |
| Package Type | 780-BBGA, FC-FBGA (Flip-Chip) | 780-ball FC-FBGA (29x29 mm) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Lead Free / RoHS | Yes (lead-free per BGA package) | — |
| Configuration Method | JTAG, Passive Serial, FPP, external memory | — |
| Design Software | Quartus II (Stratix III device support) | — |
| Logic Elements | — | 67,500 |
| Adaptive Logic Modules (ALMs) | — | 33,750 |
| Embedded Memory Bits | — | 2,699,264 bits (2.699 Mbit) |
| Embedded Multipliers (18x18) | — | 488 |
| Maximum Operating Frequency | — | 717 MHz |
| Core Voltage | — | 1.1 V |
| Number of I/O Banks | — | 8 |
| Número de pines | — | 780 |
| Rango de temperatura de funcionamiento | — | Commercial (0C to +85C) |
| Estado RoHS | — | Compliant (lead-free FBGA) |
| Nivel MSL | — | 3 (per JEDEC J-STD-020) |