EP3SL70F780C4LG vs EP3SL70F780C4L Vergleich

Detaillierter Direktvergleich von EP3SL70F780C4LG von Intel und EP3SL70F780C4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SL70F780C4LG EP3SL70F780C4L
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $380,00 $944,74
Family Stratix III L —
Series Stratix III Stratix III L
Logic Elements (LE) 67,500 67,500
Adaptive Logic Modules (ALM) 27,000 —
Embedded Memory 2,699,264 bit (2.57 Mbit) —
User I/Os 488 —
Operating Supply Voltage (Core) 1.1 V —
Speed Grade -4 C4
Gehäuse 780-Ball FCBGA —
Montageart Surface Mount (SMD/SMT) Surface Mount (BGA)
Betriebstemperaturbereich 0C to +85C (Commercial) —
RoHS-Status Compliant —
MSL-Level [DATA_NEEDED: MSL level] —
Multi-Gigabit Transceivers [DATA_NEEDED: number of MGT channels] —
DSP Blocks [DATA_NEEDED: number of variable-precision DSP blocks] —
Lead-Free Yes —
Manufacturer — Intel (formerly Altera)
Device Type — FPGA - Field Programmable Gate Array
Total Memory Bits — 2,699,264 bits (~2.7 Mb)
Logic Array Blocks (LABs) — 2,700
Maximum User I/O — 488
Process Technology — 65 nm
Internal Frequency (max) — [DATA_NEEDED: internal frequency]
Core Voltage (VCC) — 0.9 V
Betriebstemperatur — 0C to 85C (commercial)
Package Type — 780-BBGA, FC-FBGA (Flip-Chip)
Lead Free / RoHS — Yes (lead-free per BGA package)
Configuration Method — JTAG, Passive Serial, FPP, external memory
Design Software — Quartus II (Stratix III device support)

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