EP3SL70F780I3N vs EP3SL70F780I4L Vergleich
Detaillierter Direktvergleich von EP3SL70F780I3N von Intel und EP3SL70F780I4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL70F780I3N | EP3SL70F780I4L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.240,00 | $1.150,00 |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 67,500 |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| Embedded Memory (bits) | 2,699,264 | — |
| User I/Os | 488 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V (1.05 V to 1.15 V) | — |
| Operating Frequency | 500 MHz | — |
| Speed Grade | I3 (industrial) | I4 |
| Package Type | 780-BBGA, FCBGA (Flip-Chip FineLine BGA) | — |
| Ball Pitch | 1.0 mm | — |
| Betriebs-Sperrschichttemperatur | -40 C to +100 C | — |
| Configuration | SRAM-based, volatile | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant (per distributor listings) | Compliant |
| Embedded Memory Bits | — | 2,699,264 |
| User I/O Pins | — | 488 |
| Gehäuse | — | 780-ball FBGA (FineLine BGA) |
| Betriebstemperatur | — | -40C to +100C (industrial) |
| Power Variant | — | L (low static power) |
| Process Node | — | 40 nm |
| Configuration Method | — | Serial / Parallel / JTAG via Quartus II |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Transceivers | — | None (logic/transceiver-less L variant) |
| PLL Count | — | [DATA_NEEDED: PLL count] |