EP3SL70F780I3N vs EP3SL70F780I4L 对比
详细并排对比 EP3SL70F780I3N 出自 Intel 和 EP3SL70F780I4L 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SL70F780I3N | EP3SL70F780I4L |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,240.00 | $1,150.00 |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 67,500 |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| Embedded Memory (bits) | 2,699,264 | — |
| User I/Os | 488 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V (1.05 V to 1.15 V) | — |
| Operating Frequency | 500 MHz | — |
| Speed Grade | I3 (industrial) | I4 |
| Package Type | 780-BBGA, FCBGA (Flip-Chip FineLine BGA) | — |
| Ball Pitch | 1.0 mm | — |
| 工作结温 | -40 C to +100 C | — |
| Configuration | SRAM-based, volatile | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| RoHS 状态 | Compliant (per distributor listings) | Compliant |
| Embedded Memory Bits | — | 2,699,264 |
| User I/O Pins | — | 488 |
| 封装 | — | 780-ball FBGA (FineLine BGA) |
| 工作温度 | — | -40C to +100C (industrial) |
| Power Variant | — | L (low static power) |
| Process Node | — | 40 nm |
| Configuration Method | — | Serial / Parallel / JTAG via Quartus II |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Transceivers | — | None (logic/transceiver-less L variant) |
| PLL Count | — | [DATA_NEEDED: PLL count] |