EP4CE10E22C8N vs EP4CE6E22C6 Vergleich
Detaillierter Direktvergleich von EP4CE10E22C8N von Intel und EP4CE6E22C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE10E22C8N | EP4CE6E22C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $11,10 | $12,05 |
| Series | Cyclone IV E | — |
| Family | EP4CE10 | Cyclone IV E |
| Logic Elements (LE) | 10,320 | — |
| Embedded Memory (M9K blocks) | 46 | — |
| Embedded Memory (total) | 414 Kbit | — |
| Maximum User I/O | 91 | — |
| Anzahl der Pins | 144 | — |
| Gehäuse | 144-LQFP Exposed Pad (E22) | — |
| Speed Grade | 8 | C6 |
| Temperature Grade | Commercial (C) | — |
| Process Technology | 60 nm low-power | TSMC 60 nm low-k |
| PLL Count | 2 | — |
| Configuration Mode | JTAG / AS / AP / PS | — |
| Betriebstemperatur | 0C to +85C | 0 °C to +85 °C (Commercial) |
| Supply Voltage (Core) | 1.0 V to 1.2 V | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Device Logic Elements | — | 6,272 LE |
| Logic Array Blocks (LABs) | — | 392 LABs |
| Total RAM Bits | — | 270 Kbit |
| Embedded 18x18 Multipliers | — | 15 |
| PLLs | — | 2 |
| Maximum User I/Os | — | 91 |
| Core Voltage | — | 1.2 V |
| Package Type | — | 144-pin EQFP (Enhanced QFP, exposed pad) |
| Package Dimensions | — | 22 mm × 22 mm |
| Lead Pitch | — | 0.5 mm |
| Configuration Method | — | SRAM-based (volatile); JTAG, Active Serial, Passive Serial |