EP4CE10E22C8N vs EP4CE6E22C6 Comparación
Comparación detallada lado a lado de EP4CE10E22C8N por Intel y EP4CE6E22C6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE10E22C8N | EP4CE6E22C6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $11,10 | $12,05 |
| Series | Cyclone IV E | — |
| Family | EP4CE10 | Cyclone IV E |
| Logic Elements (LE) | 10,320 | — |
| Embedded Memory (M9K blocks) | 46 | — |
| Embedded Memory (total) | 414 Kbit | — |
| Maximum User I/O | 91 | — |
| Número de pines | 144 | — |
| Encapsulado | 144-LQFP Exposed Pad (E22) | — |
| Speed Grade | 8 | C6 |
| Temperature Grade | Commercial (C) | — |
| Process Technology | 60 nm low-power | TSMC 60 nm low-k |
| PLL Count | 2 | — |
| Configuration Mode | JTAG / AS / AP / PS | — |
| Temperatura de funcionamiento | 0C to +85C | 0 °C to +85 °C (Commercial) |
| Supply Voltage (Core) | 1.0 V to 1.2 V | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Device Logic Elements | — | 6,272 LE |
| Logic Array Blocks (LABs) | — | 392 LABs |
| Total RAM Bits | — | 270 Kbit |
| Embedded 18x18 Multipliers | — | 15 |
| PLLs | — | 2 |
| Maximum User I/Os | — | 91 |
| Core Voltage | — | 1.2 V |
| Package Type | — | 144-pin EQFP (Enhanced QFP, exposed pad) |
| Package Dimensions | — | 22 mm × 22 mm |
| Lead Pitch | — | 0.5 mm |
| Configuration Method | — | SRAM-based (volatile); JTAG, Active Serial, Passive Serial |