EP4CE55F29C7N vs EP4CE55F23I7N Vergleich
Detaillierter Direktvergleich von EP4CE55F29C7N von Intel und EP4CE55F23I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE55F29C7N | EP4CE55F23I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $138,00 | $130,40 |
| Family | Cyclone IV E | — |
| Logic Elements (LE) | 55,856 | — |
| Configurable Logic Blocks (CLBs) | 3,491 | 3,491 |
| Total RAM Bits | 2,396,160 | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| User I/O Count | 374 | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Gehäuse | 780-ball FBGA (F29) | 484-ball FBGA (23x23 mm, 1.0 mm pitch) |
| Package Dimensions | 29 mm x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Betriebstemperatur | 0C to +85C (commercial) | -40C to +100C (industrial, I7 grade) |
| Speed Grade | -7 (C7) | — |
| Core Voltage | 1.2 V nominal | 1.2 V |
| Versorgungsspannung | 1.2 V | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant (LEAD FREE) | — |
| Lead Free | Yes | — |
| Configuration Mode | JTAG, Active Serial, Passive Parallel | — |
| Series | — | Cyclone IV E |
| Logic Elements | — | 55,856 |
| Embedded Memory | — | 2,396,160 bits |
| Embedded 18x18 Multipliers | — | 56 |
| PLLs | — | 4 |
| Maximum User I/O | — | 324 |
| Process Technology | — | TSMC 60 nm low-power |
| Lead-Free / RoHS | — | Yes (lead-free finish) |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| Memory Interface Support | — | DDR, DDR2, QDRII |