EP4CE55F29C7N vs EP4CE55F23I7N Comparación
Comparación detallada lado a lado de EP4CE55F29C7N por Intel y EP4CE55F23I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE55F29C7N | EP4CE55F23I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $138,00 | $130,40 |
| Family | Cyclone IV E | — |
| Logic Elements (LE) | 55,856 | — |
| Configurable Logic Blocks (CLBs) | 3,491 | 3,491 |
| Total RAM Bits | 2,396,160 | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| User I/O Count | 374 | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Encapsulado | 780-ball FBGA (F29) | 484-ball FBGA (23x23 mm, 1.0 mm pitch) |
| Package Dimensions | 29 mm x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | -40C to +100C (industrial, I7 grade) |
| Speed Grade | -7 (C7) | — |
| Core Voltage | 1.2 V nominal | 1.2 V |
| Tensión de alimentación | 1.2 V | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant (LEAD FREE) | — |
| Lead Free | Yes | — |
| Configuration Mode | JTAG, Active Serial, Passive Parallel | — |
| Series | — | Cyclone IV E |
| Logic Elements | — | 55,856 |
| Embedded Memory | — | 2,396,160 bits |
| Embedded 18x18 Multipliers | — | 56 |
| PLLs | — | 4 |
| Maximum User I/O | — | 324 |
| Process Technology | — | TSMC 60 nm low-power |
| Lead-Free / RoHS | — | Yes (lead-free finish) |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| Memory Interface Support | — | DDR, DDR2, QDRII |