EP4CE55F29C8L vs EP4CE55F29I8L Vergleich
Detaillierter Direktvergleich von EP4CE55F29C8L von Intel und EP4CE55F29I8L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE55F29C8L | EP4CE55F29I8L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $150,00 | $131,42 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 55,856 | — |
| Embedded Memory Bits | 2,396,160 bits | 2,396,160 bits |
| Embedded Memory (M9K Blocks) | 260 blocks | — |
| Embedded 18x18 Multipliers | 156 | 156 |
| Maximum User I/O Pins | 374 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Core Voltage | 1.2 V | — |
| Process Technology | 60 nm (low-power) | 60 nm low-power |
| Gehäuse | 780-ball FBGA (F29), 29x29 mm, 1.0 mm pitch | 780-FBGA (FineLine BGA), 29x29 mm |
| Speed Grade | C8 (commercial, 8 speed bin) | 8 |
| Betriebstemperatur | 0C to +85C (commercial, 'L' suffix) | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| Configuration Schemes | AS, PS, JTAG, FPP | — |
| JTAG (IEEE 1149.1) | Supported | — |
| Configuration Memory | SRAM-based (external flash required) | — |
| Device Logic Elements | — | 55,856 |
| Maximum User I/Os | — | 374 |
| Logic Array Blocks (LABs) | — | 3,435 |
| Core Voltage VCCINT | — | 1.0 V / 1.2 V |
| Auxiliary Voltage VCCAUX | — | 2.5 V |
| I/O Voltage VCCIO | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Operating Temperature (Industrial) | — | -40C to +100C junction |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, Active Serial, JTAG |