EP4CE55F29C9L vs EP4CE55F29I8LN Vergleich
Detaillierter Direktvergleich von EP4CE55F29C9L von Intel und EP4CE55F29I8LN von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE55F29C9L | EP4CE55F29I8LN |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $98,60 | $165,00 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 55,856 | — |
| Logic Array Blocks (LABs) | 3,491 | 3,135 |
| Total RAM Bits | 2,396,160 | — |
| Embedded 18x18 Multipliers | 154 | — |
| PLLs | 4 | 4 |
| User I/Os | 374 | — |
| Gehäuse | 780-ball FBGA (F29) | 780-ball FBGA (F29) |
| Speed Grade | 9 (C9 - commercial) | — |
| Betriebstemperatur | 0C to +85C (commercial) | -40C to +85C (Industrial) |
| Process Technology | 60 nm low-power | 60 nm TSMC low-power |
| Supply Voltage (Core) | 1.2 V | — |
| Configuration Method | JTAG / AS / PS / FPP | — |
| RoHS-Status | Compliant | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Device Model | — | EP4CE55 |
| Logic Elements (LEs) | — | 55,856 |
| Total Embedded Memory Bits | — | 2,396,160 bits |
| Embedded Memory (M9K blocks) | — | 260 blocks |
| 18x18 Hardware Multipliers | — | 374 |
| Maximum User I/O Pins | — | 374 |
| Core Voltage | — | 1.2 V |
| Ball Pitch | — | 1.0 mm |
| Lead-Free / RoHS | — | Yes (per OPN suffix N) |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| Supported I/O Standards | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |