EP4CE55F29I7N vs EP4CE40F29C6 Vergleich
Detaillierter Direktvergleich von EP4CE55F29I7N von Intel und EP4CE40F29C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE55F29I7N | EP4CE40F29C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $154,80 | $84,10 |
| Family | Cyclone IV E | Cyclone IV E (FPGA) |
| Logic Elements (LE) | 55,856 | 39,600 |
| Embedded Memory Bits | 2,396,160 | — |
| Number of LABs/CLBs | 3491 | — |
| Maximum User I/O | 374 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Number of PLLs | 4 | — |
| Global Clock Networks | 20 | 20 |
| Dedicated Clock Pins | 11 | — |
| Embedded Multipliers (18x18) | 154 | 116 |
| Gehäuse | 780-ball FBGA (F29), 29 mm x 29 mm, 1.0 mm pitch | 780-BGA (FBGA, 29 mm x 29 mm) |
| Speed Grade | I7 (industrial) | — |
| Betriebs-Sperrschichttemperatur | -40 C to +100 C | — |
| Process Technology | 60 nm low-k | 60 nm (TSMC low-power) |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Supply Type | Tray | — |
| Series | — | Cyclone IV E |
| Embedded Memory | — | 1,161,216 bits (113 x M9K blocks) |
| User I/O Pins | — | 532 |
| PLLs | — | 4 |
| Core Voltage | — | 1.2 V |
| Betriebstemperatur | — | 0C to +85C (Commercial) |
| MSL-Level | — | [DATA_NEEDED: moisture sensitivity level] |
| Configuration Mode | — | JTAG (IEEE 1149.1), Active Serial (AS), Passive Serial (PS) |
| I/O Standards | — | LVDS, LVCMOS, SSTL, HSTL |