EP4CE6E22C6 vs EP4CE6E22C6N Vergleich
Detaillierter Direktvergleich von EP4CE6E22C6 von Intel und EP4CE6E22C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE6E22C6 | EP4CE6E22C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $12,05 | $11,20 |
| Family | Cyclone IV E | Cyclone IV E |
| Device Logic Elements | 6,272 LE | — |
| Logic Array Blocks (LABs) | 392 LABs | [DATA_NEEDED: LAB count] |
| Total RAM Bits | 270 Kbit | — |
| Embedded 18x18 Multipliers | 15 | 15 |
| PLLs | 2 | 2 |
| Maximum User I/Os | 91 | 91 |
| Core Voltage | 1.2 V | — |
| Speed Grade | C6 | — |
| Betriebstemperatur | 0 °C to +85 °C (Commercial) | -40 C to +85 C (industrial, C6 speed grade) |
| Package Type | 144-pin EQFP (Enhanced QFP, exposed pad) | — |
| Package Dimensions | 22 mm × 22 mm | — |
| Lead Pitch | 0.5 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Process Technology | TSMC 60 nm low-k | 60 nm |
| Configuration Method | SRAM-based (volatile); JTAG, Active Serial, Passive Serial | — |
| RoHS-Status | Compliant | Lead-Free / Compliant |
| Device | — | EP4CE6 |
| Logic Elements (LEs) | — | 6,272 |
| Embedded Memory (M9K blocks) | — | [DATA_NEEDED: M9K block count] |
| Embedded Memory (Bits) | — | 270 Kbits |
| Global Clock Networks | — | 10 |
| I/O Banks | — | 4 |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Configuration Modes | — | JTAG, AS (Active Serial), PS (Passive Serial) |
| Gehäuse | — | 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch) |
| Lead-Free | — | Yes |